Company:
Qualcomm India Private Limited
Job Area:
Engineering Group, Engineering Group > Hardware Engineering
General Summary:
Job Description : (PDN Sign off Lead/Sr Engineer)
IR Signoff CPU/high performance cores
Signal EM & Power EM Signoff for Chip TOP level & Block level CPU/DSP and other HM’s
Development of PG Grid spec for different HM
Validating the PG Grid using Grid Resistance & Secondary PG Resistance Checks
Validating the IR Drops using Static IR , Dynamic IR Vless & VCD Checks for validating Die & Pkg Components of IR Drops
Working with SOC and Packaging Teams on Bumps Assignments / RDL Enablement / Pkg Routing Optimizations to improve overall PDN Design
Good knowledge on PD would is desirable.
Python , Perl , TCL
Skill Set
Hands on experience in PDN Signoff using Redhawk / RHSC / Voltus at block level / SOC Level.
Good understanding on Power Integrity Signoff Checks.
Proficient in scripting languages (Tcl and Perl).
Familiarity with Innovus for RDL / Bump Planning.
Ability to communicate effectively with multiple global cross-functional teams.
Tools : Redhawk , Redhawk_SC and basic use case of Innovus/ Fusion Compiler
Power Planning/Floorplanning ,Physical Verification hands on experience is added advantage.
LSF /compute optimization understanding.
Minimum Qualifications:
• Bachelor’s degree in Computer Science, Engineering, Information Systems, or related field and 3+ years of Hardware Engineering or related work experience.
OR
Master’s degree in Computer Science, Engineering, Information Systems, or related field and 2+ years of Hardware Engineering or related work experience.
OR
PhD in Computer Science, Engineering, Information Systems, or related field and 1+ year of Hardware Engineering or related work experience.
Minimum Qualifications
Education:
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